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M34
www.vishay.com
DIMENSIONS in inches [millimeters]
Vishay
L
W
P
CASE CODE
C
L (MAX.)
0.835
[21.2]
W
0.315 ± 0.012
[8 ± 0.3]
H
0.295 ± 0.012
[7.5 ± 0.3]
P (MIN.)
0.118
[3.0]
T W
0.236 ± 0.012
[6.0 ± 0.3]
T H (MIN.)
0.075
[1.9]
RECOMMENDED REFLOW PROFILES
T p °C
t p
T L °C
25 °C
T s MAX. °C
T s MIN. °C
PREHEAT (t s )
TIME (s)
ALL CASE CODES
(t L )
T p T p
Lead (Pb)-free Sn/Pb
t p
T L T L T s MIN.
Lead (Pb)-free Sn/Pb Lead (Pb)-free
T s MIN.
Sn/Pb
T s MAX.
Lead (Pb)-free
T s MAX.
Sn/Pb
t s
Lead (Pb)-free
t s
Sn/Pb
t L
245 °C
220 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 to 150
60 to 90 60
MOUNTING
Due to the size and weight of these capacitors, we recommend that a supplemental mounting restraint to be used in printed
circuit board attachment in addition to the reflowed solder.
One recommendation is to use an adhesive such as defined in the J-STD-001DS.
This is the Space Application Electronic Hardware Addendum to J-STD-001 (Requirements for Solder Electrical and Electronic
Assemblies).
Revision: 28-Jul-11
2
Document Number: 40106
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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